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The KS-PVD-EVP2 represents the next generation of tabletop vacuum evaporation systems, purpose-built for researchers, materials scientists, and industrial laboratories seeking precision, versatility, and reliability in thin film deposition. Its robust stainless steel chamber, coupled with a dual-source configuration, provides an exceptionally controlled environment for a wide range of coating processes, enabling high-quality films with excellent uniformity and adhesion.
Technical Parameters
KS-PVD-EVP2 Tabletop Dual-Source Stainless Steel Vacuum Evaporation System
The KS-PVD-EVP2 represents the next generation of tabletop vacuum evaporation systems, purpose-built for researchers, materials scientists, and industrial laboratories seeking precision, versatility, and reliability in thin film deposition. Its robust stainless steel chamber, coupled with a dual-source configuration, provides an exceptionally controlled environment for a wide range of coating processes, enabling high-quality films with excellent uniformity and adhesion.
One of the key advantages of the KS-PVD-EVP2 is its high-vacuum operation. Maintaining a deep vacuum environment is essential for achieving pure, defect-free films and preventing contamination from residual gases. By creating a near-perfect vacuum, this system ensures that materials evaporate cleanly, deposit uniformly, and retain their intrinsic properties. This is particularly important for applications in optics, semiconductors, nanotechnology, and surface engineering, where material purity and surface morphology have a direct impact on performance.
The dual-source evaporation design provides a significant advantage over single-source systems. It allows simultaneous deposition from two independent sources, enabling co-evaporation of multiple materials or the creation of multilayer structures with precision. Researchers can explore advanced material combinations, develop functional coatings, and fabricate complex multilayer architectures without the need for multiple runs. This flexibility makes the system ideal for developing experimental prototypes, functional coatings, and high-performance optical or electronic films.
Technical Parameters:
| No. | Parameter | Specification |
| 1 | Vacuum Chamber | 180x200 mm, stainless steel 304, top opening design, front 90 mm observation window with baffle |
| 2 | Sample Stage | 60 mm stainless steel, adjustable rotation speed 0-20 rpm |
| 3 | Evaporation Source | Max 150 A (manual and automatic PID control, switchable modes) |
| 4 | Evaporation Source Baffle | Manual |
| 5 | Vacuum Gauge | Composite vacuum gauge, RBF-181 |
| 6 | Main Valve | Manual baffle valve KF16 |
| 7 | Exhaust Valve | 6.35 mm solenoid shut-off valve |
| 8 | Vacuum Line | KFE16 stainless steel corrugated hose |
| 9 | Film Thickness Meter | TM106 |
| 10 | Mechanical Pump | VRD-4 (1.1 L/s) |
| 11 | Control System | PLC + HMI intelligent control system |
| 12 | Accessories | Sealing rings, flange supports |
| 13 | Model | KS-PVD-EVP2 |
| 14 | Power Supply | AC 220V 50Hz/60Hz, 500 W |
| 15 | Evaporation Power | 1000 W, max current 150 A |
| 16 | Evaporation Sources | 2 source, max temperature 1800°C |
| 17 | Film Thickness Meter Resolution | 0.1 Å |
| 18 | Mechanical Pump Flow | 1.1 L/s |
| 19 | Ultimate Vacuum | 5×10⁻⁵ Pa |