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High-Vacuum Dual-Source Evaporation System for Precision Thin Film Deposition

The KS-PVD-EVP2 represents the next generation of tabletop vacuum evaporation systems, purpose-built for researchers, materials scientists, and industrial laboratories seeking precision, versatility, and reliability in thin film deposition. Its robust stainless steel chamber, coupled with a dual-source configuration, provides an exceptionally controlled environment for a wide range of coating processes, enabling high-quality films with excellent uniformity and adhesion.


Technical Parameters

KS-PVD-EVP2 Tabletop Dual-Source Stainless Steel Vacuum Evaporation System

The KS-PVD-EVP2 represents the next generation of tabletop vacuum evaporation systems, purpose-built for researchers, materials scientists, and industrial laboratories seeking precision, versatility, and reliability in thin film deposition. Its robust stainless steel chamber, coupled with a dual-source configuration, provides an exceptionally controlled environment for a wide range of coating processes, enabling high-quality films with excellent uniformity and adhesion.

One of the key advantages of the KS-PVD-EVP2 is its high-vacuum operation. Maintaining a deep vacuum environment is essential for achieving pure, defect-free films and preventing contamination from residual gases. By creating a near-perfect vacuum, this system ensures that materials evaporate cleanly, deposit uniformly, and retain their intrinsic properties. This is particularly important for applications in optics, semiconductors, nanotechnology, and surface engineering, where material purity and surface morphology have a direct impact on performance.

The dual-source evaporation design provides a significant advantage over single-source systems. It allows simultaneous deposition from two independent sources, enabling co-evaporation of multiple materials or the creation of multilayer structures with precision. Researchers can explore advanced material combinations, develop functional coatings, and fabricate complex multilayer architectures without the need for multiple runs. This flexibility makes the system ideal for developing experimental prototypes, functional coatings, and high-performance optical or electronic films.

Technical Parameters:

No.ParameterSpecification
1Vacuum Chamber180x200 mm, stainless steel   304, top opening design, front 90 mm observation window with baffle
2Sample Stage60 mm stainless steel,   adjustable rotation speed 0-20 rpm
3Evaporation SourceMax 150 A (manual and automatic   PID control, switchable modes)
4Evaporation Source BaffleManual
5Vacuum GaugeComposite vacuum gauge, RBF-181
6Main ValveManual baffle valve KF16
7Exhaust Valve6.35 mm solenoid shut-off valve
8Vacuum LineKFE16 stainless steel   corrugated hose
9Film Thickness MeterTM106
10Mechanical PumpVRD-4 (1.1 L/s)
11Control SystemPLC + HMI intelligent control   system
12AccessoriesSealing rings, flange supports
13ModelKS-PVD-EVP2
14Power SupplyAC 220V 50Hz/60Hz, 500 W
15Evaporation Power1000 W, max current 150 A
16Evaporation Sources2 source, max temperature   1800°C
17Film Thickness Meter Resolution0.1 Å
18Mechanical Pump Flow1.1 L/s
19Ultimate Vacuum5×10⁻⁵ Pa