Compact Dual-Source DC/RF Magnetron Sputtering System for Thin Film Deposition

Three-Target Magnetron Sputtering System Description

The three-target magnetron sputtering system is designed for flexible thin film deposition and co-sputtering applications. It is equipped with three independent magnetron sputtering cathodes, allowing sequential sputtering, co-sputtering, or multilayer film deposition within a single process cycle.

Each magnetron target can be configured with DC or RF power supplies according to the material properties, making the system suitable for metallic, alloy, semiconductor, ceramic, and dielectric coatings. Independent power control enables precise adjustment of deposition rates and film composition.

The vacuum chamber is manufactured from high-quality stainless steel and features multiple ports for magnetron heads, gas inlets, vacuum pumping, and observation windows. Uniform film thickness is achieved through optimized target geometry and optional substrate rotation.

This three-target magnetron sputtering system is widely used in research and development, functional thin films, optical coatings, electronic materials, and advanced material studies, where high repeatability, process flexibility, and material compatibility are required.

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