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High Vacuum Dual-Source DC/RF Magnetron Sputtering Coater with 2" Targets

The KS-PVD-3HD-LD is a compact magnetron sputtering system designed for thin film deposition and materials research. The system is equipped with dual 2-inch magnetron sputtering sources, allowing flexible configuration with DC and RF power supplies to meet different coating requirements.

Technical Parameters

Product Description:

The KS-PVD-3HD-LD is a compact magnetron sputtering system designed for thin film deposition and materials research. The system is equipped with dual 2-inch magnetron sputtering sources, allowing flexible configuration with DC and RF power supplies to meet different coating requirements.

One sputtering source can be configured with a DC power supply for efficient deposition of metallic films, while the other source can be equipped with an RF power supply for coating non-conductive materials. This flexible design enables the system to perform co-sputtering processes as well as multi-layer thin film deposition, making it suitable for advanced research and development applications.

The system supports a wide range of coating materials, including alloys, ferroelectric materials, semiconductors, ceramics, and dielectric films. With precise process control and a compact footprint, the KS-PVD-3HD-LD is well suited for laboratory-scale thin film research, materials development, and functional coating studies.

 

High Vacuum Dual-Source DC/RF Magnetron Sputtering Coater with 2

High Vacuum Dual-Source DC/RF Magnetron Sputtering Coater with 2


Technical parameters:

ItemSpecification
ModelKS-PVD-3HD-LD
Input Power220 VAC, 50/60 Hz, single phase
Total Power Consumption2000 W (including vacuum pump)
Power Source OptionsOptional: single DC power source,   single RF power source, or DC + RF power sources
DC Power Source500 W, for coating metallic materials
RF Power SourceCompact 300 RF power source, for   non-conductive materials
Magnetron Sputtering HeadsThree 2" magnetron sputtering   heads included
Magnetron Head CoolingWater-cooled jackets
Head Water Cooling Requirement10 ml/min water flow per head
Vacuum Chamber SizeØ300 mm × 300 mm (H)
Vacuum Chamber MaterialStainless steel
Observation WindowØ100 mm
Chamber CoverHinged top cover with air spring   support for easy target exchange
Sample Holder SizeØ140 mm, supports up to 4" wafer
Sample Holder Rotation SpeedAdjustable, 1–20 rpm
Sample Holder Temperature RangeRoom temperature to 500 °C
Temperature Control Accuracy±1.0 °C
Gas Flow ControlTwo precision digital mass flow   controllers (MFC)
Gas TypesSupports two different gases
Maximum Gas Flow Rate200 ml/min
Gas Flow Control InterfaceAdjustable via 6" touch screen   control panel
Turbo Molecular PumpHigh-speed turbo pump, made in   Germany, directly mounted on chamber
Backing PumpHeavy-duty dual-stage mechanical pump
Pump StationMobile pump station included
Maximum Vacuum Level10⁻⁶ Torr (with chamber   baking)
Overall DimensionsL1300 × W660 × H1200 mm
Net Weight160 kg
Warranty2 years limited warranty with lifetime   technical support