Home - Products - PVD Coating Machine - Four-Source Thermal Evaporation System for Metal, Optical and Semiconductor Thin Film Deposition
The KS-PVD-EVP4 Four-Source Thermal Evaporation Coating System is a compact and high-performance thin film deposition system designed for research and small-scale production applications. The system is equipped with four independent tungsten evaporation sources, allowing sequential or co-evaporation of multiple materials without breaking vacuum, greatly improving coating efficiency and film quality.
Technical Parameters
Product Description – Four Source Thermal Evaporation Coating System
The KS-PVD-EVP4 Four-Source Thermal Evaporation Coating System is a compact and high-performance thin film deposition system designed for research and small-scale production applications. The system is equipped with four independent tungsten evaporation sources, allowing sequential or co-evaporation of multiple materials without breaking vacuum, greatly improving coating efficiency and film quality.
The stainless steel vacuum chamber is electropolished to ensure low outgassing and high vacuum performance. With a turbo molecular pump system, the vacuum level can reach up to 5×10⁻⁷ Torr, ensuring high purity thin film deposition. The system is equipped with a rotary sample holder to improve film uniformity, and a quartz crystal microbalance (QCM) can be installed for precise thickness monitoring and control.
Motorized shutters are installed for each evaporation source, enabling accurate control of deposition sequence and film thickness. The system is widely used for metal film deposition, electrode preparation, optical coatings, semiconductor research, and material science applications.
The system features an integrated control unit for vacuum, power, and thickness control, making operation simple, stable, and reliable.
Technical Parameters:
| Item | Parameter |
| Model | KS-PVD-EVP4 |
| Power Supply | 208–240 VAC |
| Current | 30 A |
| Frequency | 50/60 Hz |
| Phase | Single phase |
| Power | 5 KVA |
| Output Voltage | 0–8 VAC max |
| Output Current | 200 A Max |
| Output Power | 1600 W Max |
| Chamber Material | Stainless steel, electropolished |
| Chamber Size | 300 mm ID × 360 mm H |
| Observation Window | 100 mm diameter |
| Chamber Door | Hinged front door |
| Shutter | Motorized shutters for each evaporation source |
| Turbo Pump Port | ISO-100K port |
| Vacuum Gauge Port | KF16 port |
| KF Port | KF40 port |
| Access Ports | Six CF35 ports |
| Film Thickness Monitor Port | CF35 port for QCM |
| Turbo Molecular Pump | 260 L/s |
| Vacuum Level | 5.0×10⁻⁶ Torr |
| Ultimate Vacuum | 5.0×10⁻⁷ Torr (after bake out at 100–150°C) |
| Leak Rate | 6.7×10⁻⁸ Pa·L/s |
| Vacuum Port | DN100 ISO-K (standard) |
| Optional Vacuum Port | DN160 ISO-K (optional) |
| Backing Pump | Mechanical pump YTP-550-LD |
| Initial Vacuum | < 1×10⁻² Torr |
| Evaporation Source | Four tungsten heating boats |
| Boat Cooling | Water-cooled shrouds |
| Tungsten Boat Size | 70L × 12W × 3H mm |
| Sample Holder | Ø120 mm rotary sample holder |
| Source to Sample Distance | 140–200 mm |
| Sample Stage Heating | Up to 500°C (optional) |
| Thickness Measurement | Quartz crystal microbalance (optional) |
| Thickness Control Accuracy | 1.0 Å |
| Control System | Vacuum, thickness, and power integrated control |
| Chilled Water Pressure | 30–60 psi (0.2–0.4 MPa) |
| Cooling Water Temperature | 15–25°C |
| Water Chiller | Recirculating water chiller recommended |
| Recommended Chiller Model | KJ5000 |
