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High-Performance 8-Inch Hot Plate Oven for Adhesives and Film Coatings

The KS-SPC-HP8 is a high-performance laboratory hot plate oven designed for precise thermal processing of coating films, adhesives, and photoresist materials. It provides uniform and controlled heating across substrates up to 8 inches in diameter, ensuring consistent curing and reliable results for a variety of laboratory and R&D applications. 


Technical Parameters

The KS-SPC-HP8 is a high-performance laboratory hot plate oven designed for precise thermal processing of coating films, adhesives, and photoresist materials. It provides uniform and controlled heating across substrates up to 8 inches in diameter, ensuring consistent curing and reliable results for a variety of laboratory and R&D applications. Equipped with a high-resolution 7-inch touch screen, users can easily set, monitor, and control the temperature with an accuracy of ±1 °C and a resolution of 0.1 °C.

Built with robust materials and an ergonomic design, this oven offers durability and long-term stability for repeated thermal cycles. Its compact footprint allows it to fit conveniently in laboratory environments, while the integrated safety features, including vacuum detection and lid-open stop sensors, ensure reliable and secure operation. Ideal for electronics, optics, material science, and advanced research, the KS-SPC-HP8 Hot Plate Oven provides both precision and reproducibility, making it an essential tool for laboratories seeking high-quality thermal curing solutions.

Technical Parameters:

ParameterSpecification
ModelKS-SPC-HP8
Systematic NameHot Plate Oven for Coating Films
Temperature Control RangeRoom Temperature to 300 °C
Temperature Resolution0.1 °C
Temperature Control Accuracy±1 °C
Temperature Uniformity<±2 %
Dimensions (W×D×H)250 × 300 × 200 mm
Weight10 kg
Hot Plate Power1500 W
Power InputAC 200–240 V, Single Phase (220 V Model)
Applicable Substrates8-inch or smaller