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The KS-VF-EBM300 Vacuum Electron Beam Melting Furnace is a high-performance vacuum melting system designed for the production of high-purity metals, refractory metals, and advanced alloys.
Technical Parameters
The KS-VF-EBM300 Vacuum Electron Beam Melting Furnace is a high-performance vacuum melting system designed for the production of high-purity metals, refractory metals, and advanced alloys. Utilizing a 300 kW thermionic electron beam gun and high-vacuum melting technology, the system provides precise energy control, excellent refining capability, and minimal contamination, making it ideal for research institutes, universities, and industrial material development.
The furnace features a horizontal double-wall water-cooled stainless steel vacuum chamber with a high-efficiency cold hearth crystallizer system. The focused electron beam delivers extremely high energy density, enabling rapid melting and effective removal of volatile impurities and non-metallic inclusions. Its advanced beam scanning system ensures uniform heat distribution, stable melting, and consistent ingot quality.
Equipped with a high-capacity vacuum system, Siemens PLC control, touchscreen HMI, and remote monitoring functions, the KS-VF-EBM300 offers reliable operation, accurate process control, and convenient data management. The modular design also simplifies maintenance and allows flexible configuration to meet various production and research requirements.
Technical Parameters:
| Item | Specification |
|---|---|
| Model | KS-VF-EVB300 |
| Product Name | Vacuum Electron Beam Melting Furnace |
| Furnace Type | Horizontal Double-Wall Water-Cooled Vacuum Chamber |
| Chamber Material | SUS304 Stainless Steel |
| Total Rated Power | 450 kW |
| Electron Beam Melting Power | 300 kW |
| Electron Gun | 1 × 300 kW Air-Cooled Thermionic Electron Gun |
| High Voltage Power Supply | IGBT High Voltage Switching Power Supply |
| Chamber Ultimate Vacuum | ≤5 × 10⁻⁴ Pa (Cold & Empty Chamber) |
| Working Vacuum | ≤5 × 10⁻³ Pa |
| Electron Gun Chamber Vacuum | ≤5 × 10⁻⁴ Pa |
| Pressure Rise Rate | ≤0.5 Pa/h |
| Pump-Down Time | ≤30 min (After Opening Main Valve) |
| Maximum Ingot Size | 30 × 200 × 300 mm |
| Cold Hearth Crystallizer | 4 Sets Water-Cooled Copper Mold Positions |
| Maximum Capacity | Up to 4 Plate Ingots per Batch |
| Vacuum System | Diffusion Pump + Roots Pump + Rotary/Slide Valve Pumps |
| Electron Gun Vacuum Pump | 2 × Molecular Pump Vacuum Units |
| Observation System | 2 Flash Observation Windows |
| Cooling System | Internal Water Cooling System |
| Electrical Control | PLC + Touch Screen Control |
| Remote Control | Remote Monitoring & Operation Supported |
| Data Communication | Ethernet (RJ45) Interface |
| Radiation Leakage | ≤1 μSv/h |
| Overall Layout | Horizontal Structure |
| Cooling Water | Industrial Pure Water |
| Power Supply | AC 380V, 3-Phase, 50Hz |
