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KS-DWC-800 High Precision Diamond Wire Cutting Machine

The KS-DWC-800 Diamond Wire Cutting Machine is a high-precision cutting system designed for processing hard and brittle materials with excellent surface quality and minimal material loss.

Technical Parameters

The KS-DWC-800 Diamond Wire Cutting Machine is a high-precision cutting system designed for processing hard and brittle materials with excellent surface quality and minimal material loss. Equipped with an endless electroplated diamond wire, the machine provides stable, high-speed cutting while reducing kerf width and improving machining efficiency.

The workpiece is fed automatically through a precision motion system, while the vertically adjustable diamond wire enables flexible cutting of samples with different sizes and thicknesses. A high-pressure cooling system effectively removes debris and dissipates heat, ensuring long wire life and consistent cutting performance.

The KS-DWC-800 is widely used for cutting single crystal silicon, silicon carbide (SiC), sapphire, optical glass, ceramics, graphite, semiconductor wafers, composite materials, gemstones, and other advanced brittle materials. It is an ideal solution for research laboratories, universities, semiconductor manufacturing, material science, and precision machining industries.

Designed with a rigid structure, automatic tension control, and user-friendly touch-screen operation, the KS-DWC-800 delivers reliable performance, high cutting accuracy, and low operating costs for both R&D and industrial production.

Technical parameters:

ParameterSpecification
ModelKS-DWC-800
Max. Cutting Size (L × W × H)700 × 800 × 500 mm
Cutting Speed0.05–30 mm/min
Max. Wire Speed0–50 m/s
Horizontal Travel700 mm
Vertical Travel300–800 mm (Adjustable)
Motor Speed4000 RPM
Diamond Wire DiameterØ0.20–Ø0.35 mm (Optional)
Tensioning MethodAutomatic Pneumatic Tension
Cooling SystemHigh-Pressure Water Cooling
Power SupplyAC 380–400 V, 3 Phase, 50/60 Hz
Machine Dimensions (L × W × H)1500 × 1700 × 1850 mm